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Thread: FAQ for miscellaneous Embedded Power IC Topics

  1. #21
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    TLE98xx: Bootloader update

    The device can be updated using FAST LIN BSL bootloader, which is already integrated.
    To evaluate this function you can order the uIO-Stick from our preferred design house Hitex.

    Link to order the uIO-Stick:
    https://www.ehitex.de/en/usb-applica...2529/uio-stick
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

  2. #22
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    Reduce EOL flashing time for ECU

    The TLE984x family has FAST-LIN Protocol support for faster EOL programming.
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  3. #23
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    Can user change CS_CUST_BSLSIZE in TLE984x Series?

    CS_CUST_BSLSIZE is preconfigured to 4K and cannot be changed.
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  4. #24
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    What are the part number and connection requirements for the debug (SWD) connector?

    The debug interface found on the ePower evaluation boards and kits use one of the ARM "standard" debug connector options - the 0.050"/1.27mm 10pin interface.

    A typical supplier and part number for the board mounted SMD connector is Samtec FTSH-105-01-L-DV. This is the "unshrouded" version, which reduces board area but makes alignment of the debugger plug more difficult. Shrouded versions are available by adding -ES or -K options to the part number. Free samples are available from Samtec. The main web page for the FTSH family is -> https://www.samtec.com/products/ftsh .

    Recommended electrical connections to the ePower device are documented in the "FAQ Application Note for TLE986xQX, TLE987xQX" application note.
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

  5. #25
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    Can the XMC Link debugger be used with ePower target devices?

    Yes, the XMC Link debugger can be used with TLE984x/TLE985x/TLE986x/TLE987x target devices. The XMC4200 microcontroller used in the XMC Link uses the same Segger FW technology as the onboard debugger used in the ePower evalkit designs. The XMC Link hardware uses isolation ICs to buffer the debug output connector. The reference voltage for the debug logic is provided by the target device, and therefore can be used with 3.3V XMC devices and the 5V ePower target devices.
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  6. #26
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    What is "GainChx" in the Documentation of ADC1 transfer function?

    "GainCHx" is the attenuation factor placed before the MUX block, which selects the input signal for the AD converter.

    In the electrical characteristics, the "GainCHx" are equivalent to the "ATTx" parameters. The "ATTx" values are specified in the chapter 29.8.1 of the datasheet.

    The name mismatch between "GainCHx" and "ATTx" (visible in the formula 22.3) is misleading in the UM (to be corrected in future UM updates).

    The "+1" in the formula 22.3 enables to have 255 (with 8-bit ADC) or 1023 (10-bit) at the ADC output, when the voltage to measure reaches its max value. For example: when VS=22V, the ADC output is 255. On the other hand, with 0V at the input, the ADC output is 1. This is equivalent to an error with at 0V at the input, equivalent to 0.4% error with 8-bit, or 0.1% with 10-bit. The calibration unit of the Measurement Core module is dedicated to cancel offset and gain errors out of the signal chain.
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

  7. #27
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    NAC / NAD address

    NAD and NAC value is set via BootRom function and are not located in the Flash address space.
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  8. #28
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    Is the bridge driver (BDRV) output (P_12.1.3) stable at any VSD over 8V?

    The Chargepump voltage VCP is stable for VSD >= 8V

    The voltage depends on the chargepump load. P_12.1.3 specifies the total voltage range.

    The characterisation of the chargepump shows a median voltage of 12.4V for 100nC Gatecharge.
    100nC for 6 MOSFETs @20kHz results in 12mA load at VCP.
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

  9. #29
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    Power dissipation calculation for Embedded Power ICs

    In order to calculate the power dissipation inside of the Embedded power devices, we recommend to use the power dissipation calculator tool on the Infineon Toolbox.

    The toolbox can be downloaded at: https://www.infineon.com/cms/en/tool...ontoolbox.html
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

  10. #30
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    TLE987x Series: Channel switching, hold and conversion time for ADC 1 or ADC2?

    The sheets attached can be used to calculate the timings for ADC 1 and ADC 2.

    ADC2_timing_calculation (1).xlsx
    ADC2_Sampling (1).xlsx
    ADC1_timing_calculation (1).xlsx
    ADC1_Sampling (1).xlsx
    Last edited by Julella VLL; Apr 15th, 2020 at 01:24 AM.
    The views expressed here are my personal opinions, have not been reviewed or authorized by Infineon and do not necessarily represent the views of Infineon.

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