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Apr 10, 2017
06:08 AM
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Apr 10, 2017
06:08 AM
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Apr 12, 2017
10:57 PM
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Apr 12, 2017
10:57 PM
RthJC is the thermal impedance between Junction to Case. This is the same irrespective of the package type, except for Full PAK where the mold compound is different / thicker adding thermal impedance. Hence except Full PAK, the remaining packages have the same Rthjc. SOT223 is also an exception, considering a very small package structure. This does not include the heat sink.
RthJA is the thermal impedance between Junction to Ambient. This includes the heat sink. Hence based on the standard heat sink assembly used during device characterization, the RthJA of different packages are different.
RthJA is the thermal impedance between Junction to Ambient. This includes the heat sink. Hence based on the standard heat sink assembly used during device characterization, the RthJA of different packages are different.
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Apr 12, 2017
10:57 PM
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Apr 12, 2017
10:57 PM
RthJC is the thermal impedance between Junction to Case. This is the same irrespective of the package type, except for Full PAK where the mold compound is different / thicker adding thermal impedance. Hence except Full PAK, the remaining packages have the same Rthjc. SOT223 is also an exception, considering a very small package structure. This does not include the heat sink.
RthJA is the thermal impedance between Junction to Ambient. This includes the heat sink. Hence based on the standard heat sink assembly used during device characterization, the RthJA of different packages are different.
RthJA is the thermal impedance between Junction to Ambient. This includes the heat sink. Hence based on the standard heat sink assembly used during device characterization, the RthJA of different packages are different.