Cooling down a chip faster by using an invention from the automotive sector

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BMW started to drill holes in the breakes to cool them down faster.
Maybe it's possible to drill holes in the metalcorpus (Kühlrippen) that cools a processor.
What do you think?
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GoKl_4594211
Employee
Employee
As for heat sinks used to help integrated circuits to dissipate heat into their environment, these heat sinks usually already are optimized for low thermal resistance between the IC and the air.
Also, The situation is different to what you describe for car breakes.

Whether changes to a given cooling scenario makes sense depends on the individual case. Often changes are not recommendable. Example: drilling holes into elements of a heat sink could reduce the area which "connects" the heat sink to the air. This would increase the thermal resistance and/or could change the airflow in disadvantageous ways.
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Not applicable
heat transfer to the environment is very fast so you need not worry where
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