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Jun 01, 2015
03:15 AM
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Jun 01, 2015
03:15 AM
Hello,
are there any special requirements for the assembly of your TVS diodes in wafer level package technology? where can I find assembly info?
thanks
D.
are there any special requirements for the assembly of your TVS diodes in wafer level package technology? where can I find assembly info?
thanks
D.
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Jun 12, 2015
01:42 AM
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Jun 12, 2015
01:42 AM
Dear Daniele,
basically you can handle them as you do with standard passive components like resistors or capacitors since they are from the same size in X and Y dimensions. The main difference between passives and our devices is the style of the terminations. Infineon Wafer Level Leadless (WLL) diodes (0201 as well as 01005) are looking LGA- like with solder pads only at the bottom of the device.
This needs to be considered for footprint and stencil design (please take look on the recommendations at http://www.infineon.com/cms/en/product/package.html?package=/packages/SMD_-_Surface_Mounted_Devices/...).
If your material, assembly machines and assembly processes are “01005” capable you will very likely be able to assemble Infineon WLL TVS diodes without issues.
Best regards,
E.B.
basically you can handle them as you do with standard passive components like resistors or capacitors since they are from the same size in X and Y dimensions. The main difference between passives and our devices is the style of the terminations. Infineon Wafer Level Leadless (WLL) diodes (0201 as well as 01005) are looking LGA- like with solder pads only at the bottom of the device.
This needs to be considered for footprint and stencil design (please take look on the recommendations at http://www.infineon.com/cms/en/product/package.html?package=/packages/SMD_-_Surface_Mounted_Devices/...).
If your material, assembly machines and assembly processes are “01005” capable you will very likely be able to assemble Infineon WLL TVS diodes without issues.
Best regards,
E.B.