Mar 18, 2020
02:34 AM
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Mar 18, 2020
02:34 AM
1 Solution
Mar 25, 2020
07:01 AM
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Mar 25, 2020
07:01 AM
Hi TechGirl,
Yes, after bolting down the PCB connection can be made by manual soldering, automatic selective soldering, or wave soldering.
During the entire soldering process take care not to exceed the appropriate process parameters (soldering temperature and time of action at the control terminals) and thus not deform and damage the plastic housing.
According to IEC 60068-2-20 the soldering temperature during the solder process should be T=(260±3)°C for a maximum time of action of tmax≤(10±1)s.
BR
Yes, after bolting down the PCB connection can be made by manual soldering, automatic selective soldering, or wave soldering.
During the entire soldering process take care not to exceed the appropriate process parameters (soldering temperature and time of action at the control terminals) and thus not deform and damage the plastic housing.
According to IEC 60068-2-20 the soldering temperature during the solder process should be T=(260±3)°C for a maximum time of action of tmax≤(10±1)s.
BR
1 Reply
Mar 25, 2020
07:01 AM
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Mar 25, 2020
07:01 AM
Hi TechGirl,
Yes, after bolting down the PCB connection can be made by manual soldering, automatic selective soldering, or wave soldering.
During the entire soldering process take care not to exceed the appropriate process parameters (soldering temperature and time of action at the control terminals) and thus not deform and damage the plastic housing.
According to IEC 60068-2-20 the soldering temperature during the solder process should be T=(260±3)°C for a maximum time of action of tmax≤(10±1)s.
BR
Yes, after bolting down the PCB connection can be made by manual soldering, automatic selective soldering, or wave soldering.
During the entire soldering process take care not to exceed the appropriate process parameters (soldering temperature and time of action at the control terminals) and thus not deform and damage the plastic housing.
According to IEC 60068-2-20 the soldering temperature during the solder process should be T=(260±3)°C for a maximum time of action of tmax≤(10±1)s.
BR