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TechGirl wrote:
Hi guys, what are the best methods to improve thermal performance of a QFN IPM in PCB design?
Because QFN IPMs have been designed to be used for heatsink-less operation, the majority of heat dissipation from the IPM happens through the PCB. Copper thickness and trace area of the PCB plays a large role in how effective this heat dissipation is. CIPOS™ Nano, our QFN IPMs, have an application note describing best PCB design techniques: Thermal performances vs PCB characteristics
In addition, an article has been written about optimizing the thermal layout for CIPOS™ Nano half-bridge modules: Optimized thermal layout
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TechGirl wrote:
Hi guys, what are the best methods to improve thermal performance of a QFN IPM in PCB design?
Because QFN IPMs have been designed to be used for heatsink-less operation, the majority of heat dissipation from the IPM happens through the PCB. Copper thickness and trace area of the PCB plays a large role in how effective this heat dissipation is. CIPOS™ Nano, our QFN IPMs, have an application note describing best PCB design techniques: Thermal performances vs PCB characteristics
In addition, an article has been written about optimizing the thermal layout for CIPOS™ Nano half-bridge modules: Optimized thermal layout