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Type: Posts; User: Julella VLL

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  1. NAC and NAD location

    NAC and NAD Values are not in the TP100.
    NAC and NAD value can be modified more than 100 times.
  2. LIN overtemperature

    User Manual we see:
    LIN Transceiver Overtemperature

    If the LIN transmitter detects an overtemperature condition the transmitter will be deactivated temporarily by entering the LIN Receive-Only...
  3. Can the Reverse Polarity Protection be placed in the GND path?

    It is not recommended to place the reverse polarity protection in the GND path.
    There are several reasons why this should be avoided:

    - Module GND != Car GND, i.e. there could be errors sensing...
  4. Do you already have an implementation on TLE987x with "sinusoidal" current control?

    We have an example code for sensorless field oriented control. The resulting current is in sinusoidal shape.
  5. What is needed to be done (in HW and SW) to make the TLE9879-QXW40 ASIL-B level?

    This is specified in the ISO26262.
    The Quality department can deliver FIT Rates and failure distribution data on request. (via eTool)
  6. After the initial calibration: is the tolerance of LP_CLK inside +/- 1.5%?

    P.3.1.4=1.5% accuracy refers not to the LP_CLK, but to the CGU / fPLL (s.a. DS rev1.0, ch. 6.3, 1st paragraph) after the PLL locks during startup at 5MHz (s.a. UM rev1.3 chapter This...
  7. Is the internal LP_CLK factory calibrated by INFINEON to 18 MHz?

    LP_CLK is the abbreviation for "Low Precision Clock". There is no end of line calibration. This oscillator source is usually used for low-power operation, e.g. WDT1 source, which has to run on an...
  8. Should GND_REF be connected to GND on PCB?

    Do not connect the GND_REF to the PCB GND.
    This will have a negative influence on the ADC1 measurement. It must stay decoupled
    GND_REF is internally connected to GND on the chip.
  9. End Of Line programming hints

    We used a "SEGGER Flasher Portable PLUS", which is handled in the same way as "Segger Flasher Pro".

    Segger Product website:
  10. How can you calculate the power dissipation inside the TLE986x and TLE987x?

    We recommend to use the power dissipation calculator tool on the Infineon Toolbox.
  11. How is the chargepump frequency derived and how can it be calculated?

    1. The charge pump clock is derived the from system clock via a clock divider.

    2. The clock divider is configured by F_CP and DITH_UPPER/LOWER

    3. The divider is combined by F_CP and...
  12. Are the internal gate resistances (RGGND) always connected to GND?

    This depends on the operating power mode of the device. The behavior is as following:

    Active mode: the BDRV is in active mode, VSD is powered. In this case, the MOSFET is driven by the active...
  13. Where does the specification for the buffer capacitors come from?

    The capacitor values ensure the stability of the power supplies under load jump conditions. Load jumps in general are sudden changes of the load of the respective regulator output (vs. line jumps,...
  14. Do you have any recommendation on overmolding TLE98xx products?

    Infineon is using state-of-the-art automotive package components.
    Overmolding causes different / new stresses at product level compared to traditional board assembly and vary depending on the...
  15. How can I protect my Program and Data from Read out?

    Note: this is Valid for the BF-Step.
    Information about the NVM-Protection can be found in the BootROM UM Rev. 1.4 Chapter and Chapter 5.4.5
    The UART BLS Mode has 6 Modes and entering them...
  16. How to update NAC and NAD via uIO Stick?

    This example code helps to download firmware via uIO Stick using VS, LIN and GND.

  17. Can the TLE987x family drive 4 MOSFETs (H-Bridge) instead of 6 MOSFETs?

    It is possible.
    Only difference is, you still have to set all 6 channels to PWM mode.
    Additional recommendations:
    Leave Bridge driver pins HS3 ,SH3 and LS3 open
    Turn off CCU6 modulation for CC62...
  18. Voltage difference between LIN_GND and GND

    Should GND and LIN_GND be separated because of the EMC?
    GND and LIN_GND have to be connected on ECU level to have the same reference.
    For EMC optimization reasons LIN_GND can be decoupled with a...
  19. Value range of AMCLK1_UP_TH and AMCLK1_LOW_TH

    What is the value range of AMCLK1_UP_TH in AMCLK_TH_HYS register?
    The upper threshold of the analog module clock can be configured between:
    0x00~0x3F = 0~63d

    If the value range of...
  20. MON Input Filter recommendations

    The MON pin can be used for battery sensing as one of a possible use case.
    In this case, the MON is not protected by the ECUs reverse polarity protection circuit, which could violate the absolute...
  21. What is the reduced functionality for VS_AMmin in the datasheet (P_1.2.3)?

    This parameter specifies an extended voltage operation range for VS below 5.5 V but above 3.0 V. The purpose is to ensure a min. functionality of the device.

    In general, the modules do not...
  22. TLE987x Series: Channel switching, hold and conversion time for ADC 1 or ADC2?

    The sheets attached can be used to calculate the timings for ADC 1 and ADC 2.

  23. Power dissipation calculation for Embedded Power ICs

    In order to calculate the power dissipation inside of the Embedded power devices, we recommend to use the power dissipation calculator tool on the Infineon Toolbox.

    The toolbox can be downloaded...
  24. Is the bridge driver (BDRV) output (P_12.1.3) stable at any VSD over 8V?

    The Chargepump voltage VCP is stable for VSD >= 8V

    The voltage depends on the chargepump load. P_12.1.3 specifies the total voltage range.

    The characterisation of the chargepump shows a median...
  25. NAC / NAD address

    NAD and NAC value is set via BootRom function and are not located in the Flash address space.
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